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HSF is a computer term for Heat Sink and Fan, a cooling component that prevents a processor from overheating by drawing heat away from it and dispersing it into the air. A heat sink is a metal component with fins that absorb heat, while the fan pushes cool air over the heat sink to force the hot air out of the computer case.

How it works

Heat Sink: A piece of metal (often aluminum or copper) with a large surface area, typically with fins, that makes direct contact with the heat-generating component, like a CPU. It absorbs and moves the heat from the component into the metal.

Thermal Paste: A special paste is applied between the component and the heat sink to fill in microscopic air gaps, creating a more efficient path for heat transfer.

Fan: A fan is attached to the heat sink to blow air across its fins. This process removes the heat from the fins and pushes it out of the computer, preventing the heat sink from getting too hot.